
From design review to final box build, each stage is managed under one quality system.
DFM and DFA checks, Gerber verification, BOM validation, stack-up analysis, and impedance review.
Single-sided, double-sided, and multilayer manufacturing across FR4, aluminum, high-Tg, and flexible technologies.
High-speed component placement, solder paste printing, reflow soldering, AOI and X-ray inspection.
Manual and wave soldering, connector assembly, transformer assembly, and mixed-technology production.
ICT and functional testing (FCT), programming, firmware loading, burn-in testing, and full QA.
Cable harness integration, enclosure assembly, final inspection, packaging, and logistics support.
A fixed sequence keeps every board traceable from requirement to delivery.
Requirement
DFM Review
PCB Fabrication
Assembly
Testing
Delivery
Request a quotation today.
Contact Us